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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE200207 Issued Date : 1993.04.12 Revised Date : 2002.08.14 Page No. : 1/4 HMJE13007 NPN EPITAXIAL PLANAR TRANSISTOR Description * High Voltage, High Speed Power Switch * Switch Regulators * PWM Inverters and Motor Controls * Solenoid and Relay Drivers * Deflection Circuits TO-220 Absolute Maximum Ratings (Ta=25C) * Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 80 W * Maximum Voltages and Currents (Ta=25C) VCEX Collector to Emitter Voltage .................................................................................... 700 V VCEO Collector to Emitter Voltage .................................................................................... 400 V VEBO Emitter to Base Voltage .............................................................................................. 9 V IC Collector Current ........................................................................................... Continuous 8 A IB Base Current .................................................................................................. Continuous 4 A Characteristics (Ta=25C) Symbol BVCEX BVCEO IEBO ICEX *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(sat) *hFE1 *hFE2 *hFE3 Min. 700 400 10 6 10 Typ. Max. 100 100 1 2 3 1.2 1.6 30 Unit V V uA uA V V V V V Test Conditions IC=1mA, VBE(off)=1.5V IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=2A, IB=0.4A IC=5A, IB=1A IC=8A, IB=2A IC=2A, IB=0.4A IC=5A, IB=1A IC=2A, VCE=5V IC=5A, VCE=5V IC=0.5A, VCE=5V *Pulse Test: Pulse Width 380us, Duty Cycle2% HMJE13007 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 100 Spec. No. : HE200207 Issued Date : 1993.04.12 Revised Date : 2002.08.14 Page No. : 2/4 Saturation Voltage & Collector Current 10000 VCE(sat) @ IB=5IB 75 C o Saturation Voltage (mV) 125 C o 1000 75 C o hFE 25 C 10 o 125 C 100 25 C o o hFE @ VCE=5V 1 1 10 100 1000 10000 10 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 VCE(sat) @ IC=4IB 10000 Saturation Voltage & Collector Current VBE(sat) @ IC=5IB Saturation Voltage (mV) 1000 125 C 25 C 100 75 C o o o Saturation Voltage (mV) 75 C 1000 25 C o o 125 C o 10 1 10 100 1000 10000 100 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Switchange Time & Collector Current 10 VCC=125V, IC=5IB1, IC=2IB2 1000 Collector Output Capacitance Switching Time (uS).. . 1 Ton Capacitance (pF) Tstg 100 Cob 10 Tf 0.1 0.1 1 10 1 0.1 1 10 100 Collector Current-IC (A) Collector Base Voltage (V) HMJE13007 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE200207 Issued Date : 1993.04.12 Revised Date : 2002.08.14 Page No. : 3/4 Safe Operating Area 10000 Collector Current-IC (mA) 1000 1mS 100mS 100 1S 10 1 1 10 100 1000 Forward Voltage-VCE (V) HMJE13007 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-220AB Dimension Marking: A D B E C Date Code Spec. No. : HE200207 Issued Date : 1993.04.12 Revised Date : 2002.08.14 Page No. : 4/4 H MJ E 13007 Control Code H I G 4 P M 3 2 1 N K Style: Pin 1.Base 2.Collector 3.Emitter O 3-Lead TO-220AB Plastic Package HSMC Package Code: E *: Typical DIM A B C D E G H Inches Min. Max. 0.2197 0.2949 0.3299 0.3504 0.1732 0.185 0.0453 0.0547 0.0138 0.0236 0.3803 0.4047 *0.6398 Millimeters Min. Max. 5.58 7.49 8.38 8.90 4.40 4.70 1.15 1.39 0.35 0.60 9.66 10.28 *16.25 DIM I K M N O P Inches Min. Max. *0.1508 0.0295 0.0374 0.0449 0.0551 *0.1000 0.5000 0.5618 0.5701 0.6248 Millimeters Min. Max. *3.83 0.75 0.95 1.14 1.40 *2.54 12.70 14.27 14.48 15.87 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMJE13007 HSMC Product Specification |
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